Samsung plans US$1.85 billion expansion of Vietnam substrate production
LG Innotek is also advancing a US$1 billion substrate factory in Haiphong, with trial production expected in the third quarter of 2027.
Samsung Electro-Mechanics has announced plans for a US$1.85 billion investment to increase semiconductor packaging substrate output in Vietnam. The company said on September 29 that the expansion would serve rising demand from AI servers and high-performance processors.
The money is earmarked for enlarging its Vietnamese subsidiary’s flip-chip ball grid array (BGA) plant. The subsidiary is targeting June 2030 for construction to be finished and operations to begin. Samsung Electro-Mechanics said the expanded facility would support customers’ medium- and long-term requirements while improving manufacturing efficiency and supply stability.
Separately, LG Innotek is completing the procedures for a US$1 billion semiconductor packaging substrate plant in Haiphong. Approved in July, it will be the company’s first such manufacturing facility outside South Korea. Trial output is expected during the third quarter of 2027, with mass production anticipated in mid-2028. The plant will extend its Haiphong activities beyond camera modules to packaging materials and components. LG Innotek is targeting almost US$2 billion in semiconductor packaging solutions revenue by 2030.
Another Haiphong investment came from Universal Scientific Industrial Shanghai, which approved US$120 million in additional funding in early September. The ASE Technology Holding subsidiary is expanding products for AI and data centres. It is working towards a previously announced capacity target of 100,000 silicon-photonics optical transceiver modules a month at the plant. The company said the planned production line would cover optical-engine manufacturing, module assembly and final testing.
