Samsung plans US$4.09 billion memory-chip testing project in Vietnam
About 63% of the planned investment would come from reinvested profits, leaving funding dependent on future earnings from Samsung’s Vietnamese operations.
An investment proposal submitted to local authorities sets out Samsung Electronics’ plan for a US$4.09 billion memory-chip testing project in Thai Nguyen province, northern Vietnam. The Korea Herald reported the proposal on October 11. Worth ₫105.79 trillion, the project would be located within Yen Binh Industrial Park.
Operations on the initial production line are scheduled for 2027’s fourth quarter, with another line following in 2028. DRAM and NAND flash memory chips packaged in Cheonan, South Korea, would undergo final tests at the Vietnamese facilities. Silicon wafer manufacturing is not part of the project.
An industry source quoted by The Korea Herald said the expansion could allow Samsung’s Korean facilities to devote more capacity to advanced memory products. The allocation of testing volumes between Vietnam and South Korea remains undisclosed.
Reinvested profits from Samsung’s Vietnamese operations are expected to provide about ₫66.64 trillion (US$2.57 billion), representing roughly 63% of the proposed spending. This financing arrangement depends on future earnings.
In a separate announcement on September 29, Samsung Electro-Mechanics outlined a KRW6.78 trillion expansion of flip-chip ball grid array substrate capacity. The proposed allocation is KRW2.51 trillion (US$1.88 billion) for its Yen Binh Industrial Park facility in Vietnam and KRW4.27 trillion (US$3.2 billion) for facilities in Sejong, South Korea.
Samsung Electro-Mechanics aims to have the Vietnamese expansion completed and operating by June 2030, while mass production in the enlarged Sejong facility is planned for September 2028. The company intends Sejong to focus on technically demanding, high-value products and Vietnam to serve rising global demand, although it already produces advanced substrates in Vietnam.
